RRAM Computing-in-Memory Using Transient Charge Transferring for Low-Power and Small-Latency AI Edge Inference

Linfang Wang, Junjie An, Wang Ye, Weizeng Li, Hanghang Gao, Yangu He, Jianfeng Gao, Jinshan Yue, Lingyan Fan, C. Dou
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Abstract

RRAM-based computing-in-memory (CIM) can potentially improve the energy- and area-efficiency for AI edge processors, yet may still suffer from performance degradations due to the large DC current and parasitic capacitance in the cell array during computation. In this work, we propose a new CIM design leveraging the transient-charge-transferring (TCT) between the parasitic capacitors in the high-density foundry-compatible two-transistor-two-resistor (2T2R) RRAM array, which can perform DC-current-free multiply-and-accumulate (MAC) operations with improved energy-efficiency, reduced latency and enhanced signal margin. The concept of TCT-CIM is silicon demonstrated using a 180nm 400Kb RRAM test-chip, which has achieved 7.36 times power reduction compared to the conventional scheme and measured read access time less than 17.22 ns.
基于瞬态电荷转移的低功耗小延迟AI边缘推断的内存中RRAM计算
基于rram的内存计算(CIM)可以潜在地提高人工智能边缘处理器的能量和面积效率,但在计算过程中,由于单元阵列中的大直流电流和寄生电容,仍然可能遭受性能下降。在这项工作中,我们提出了一种新的CIM设计,利用高密度铸造厂兼容双晶体管-双电阻(2T2R) RRAM阵列中寄生电容器之间的瞬态电荷转移(TCT),可以执行无直流的乘法和累积(MAC)操作,提高能效,减少延迟和增强信号余量。TCT-CIM的概念是用180nm 400Kb RRAM测试芯片演示的,与传统方案相比,该方案的功耗降低了7.36倍,测量的读取访问时间小于17.22 ns。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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