The impact of miniaturization and passive component integration in emerging MCM applications

Abstract

We have designed multichip modules using three alternative technologies for a variety of applications, and have used the results to study the impact of miniaturization and passive component integration on module size, distribution of net length and estimated cost. We have chosen representative applications that include: a digital application with dense interconnections, a mixed-signal application for low-end portable electronics and an analog application requiring a large number of passive components. We compare conventional, laminate-based MCM technology with advanced thin-film-on-laminate technology and silicon-based thin-film MCM technology. We find that the advanced highly miniaturized technologies result not only in higher packaging density and shorter average net length, but in lower estimated module cost as well. Passive component integration can also lower module cost especially in mixed-signal and analog applications.