Native-Mode Self Test for Embedded Systems on a Chip

J. Abraham
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Abstract

Advances in semiconductor technology have enabled the integration of digital, mixed-signal, and RF systems on a single chip. While systems on a chip (SoCs) offer many benefits in cost and performance, they pose significant challenges for testing after manufacture. Trends in technology as well as applications which pose problems for conventional test will be described. A novel approach which uses the computational resources of an SoC to test itself will be described as a way to deal with emerging test problems. Techniques to test the embedded digital, analog and RF modules in the SoC will be discussed. Results of simulations and measurements on prototype hardware show that the approach can predict the specifications of the modules with high accuracy, pointing towards a new direction for low-cost manufacturing test of future products.
芯片上嵌入式系统的本地模式自测试
半导体技术的进步使数字、混合信号和射频系统集成在单个芯片上成为可能。虽然片上系统(soc)在成本和性能方面具有许多优势,但它们对制造后的测试提出了重大挑战。技术的发展趋势以及对常规测试提出问题的应用将被描述。一种利用SoC的计算资源来测试自身的新方法将被描述为一种处理新出现的测试问题的方法。将讨论在SoC中测试嵌入式数字、模拟和射频模块的技术。仿真和样机硬件测试结果表明,该方法可以较准确地预测模块的规格,为未来产品的低成本制造测试指明了新的方向。
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