{"title":"Status and Directions in Microwave Packaging","authors":"B. Berson","doi":"10.1109/SARNOF.1993.657965","DOIUrl":null,"url":null,"abstract":"Introduction Over the past several years there have been dramatic increases in the performance and decreases in the cost of microwave devices. There have not, however, been accompanying changes in microwave packaging. The result is that packaging is the major bottleneck in meeting the cost and performance objectives of military, consumer, and clommercial systems. In this talk I will review the status of packaging and suggest directions that will lead to higher levels of performance and lower cost.","PeriodicalId":355387,"journal":{"name":"1993 IEEE Princeton Section Sarnoff Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1993 IEEE Princeton Section Sarnoff Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SARNOF.1993.657965","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Introduction Over the past several years there have been dramatic increases in the performance and decreases in the cost of microwave devices. There have not, however, been accompanying changes in microwave packaging. The result is that packaging is the major bottleneck in meeting the cost and performance objectives of military, consumer, and clommercial systems. In this talk I will review the status of packaging and suggest directions that will lead to higher levels of performance and lower cost.