An overview of computer packaging architecture and electrical design

C. Chang
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引用次数: 3

Abstract

A discussion of packaging architecture is presented to understand the requirement on the physical design of the single chip module (SCM), multichip module (MCM), printed circuit board (PCB), connector, and cable. They in turn establish the driving force for their electrical designs. The packaging architecture of midrange, mainframe, and workstation computer systems provides an insight into the requirements of the physical and electrical design of electronic packaging of the future. It is important to ensure the electrical signal fidelity throughout the interconnection to limit the switching noise and signal crosstalk, and to minimize the propagation delay due to packaging. Electrical design with these consideration for chip carrier, printed circuit boards, connector, and cables is described.<>
计算机封装体系结构和电气设计概述
通过对封装体系结构的讨论,了解其对单片机模块、多芯片模块、印刷电路板、连接器和电缆的物理设计要求。他们反过来又为他们的电气设计建立了驱动力。中端、大型机和工作站计算机系统的封装体系结构提供了对未来电子封装的物理和电气设计要求的洞察。确保整个互连过程中的电信号保真度,限制开关噪声和信号串扰,并尽量减少由于封装引起的传播延迟是非常重要的。描述了芯片载体、印刷电路板、连接器和电缆的电气设计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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