Application of the latency insertion method to electro-thermal circuit analysis

Abstract

In this paper, a fast circuit simulation technique based on the Latency Insertion Method (LIM) is proposed for the electro-thermal analysis of circuits and high-performance systems. The method is applied to the modeling of on-chip and off-chip 3D-interconnect networks. The proposed method is shown to be capable of modeling both electrical and thermal phenomena occurring in high speed, high performance VLSI circuits at the pre-layout design stages.