Body Bias Dependence of Hot Carrier Degradation (HCD) in Advanced FinFET Technology

Jiayang Zhang, Zixuan Sun, Runsheng Wang, Zhuoqing Yu, P. Ren, Ru Huang
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引用次数: 4

Abstract

In this paper, the impact of body bias on hot carrier degradation (HCD) in advanced FinFET devices is experimentally investigated. It is observed that the degradation of Idsat is increasing with body bias for the short-channel core devices, while an opposite tendency is found in the long-channel IO devices. The different dependences are found due to the mechanisms of the single-carrier event (SCE) in short-channel devices but the multi-carrier event (MVE) in long-channel devices. The results are helpful for the physical understanding of HCD in FinFET devices.
先进FinFET技术中热载流子降解(HCD)的体偏置依赖性
本文通过实验研究了体偏置对先进FinFET器件热载流子降解(HCD)的影响。研究发现,对于短通道核心器件,随着体偏置的增加,Idsat的退化会增加,而在长通道IO器件中则相反。由于短通道器件中的单载波事件(SCE)机制和长通道器件中的多载波事件(MVE)机制的不同,发现了不同的依赖性。这些结果有助于对FinFET器件中HCD的物理理解。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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