InAIN/GaN MOSHEMT with Al2O3 insulating film

K. Cico, D. Gregušová, J. Kuzmík, M. di Forte-Poisson, T. Lalinsky, D. Pogany, S. Delage, K. Frohlich
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Abstract

In this article, we investigate the effect of a rapid thermal annealing (RTA) on electrical properties InAIN/GaN MOSHEMT with Al2O3 insulating film. On samples, we measured input, output and pulse characteristics. Consequently, a threshold voltage and an extrinsic transconductance was determined. A more dramatic influence of RTA was observed after annealing at 700degC. In this case, a reduction of the leakage current was about 7 orders of magnitude compared with HEMT structures without the insulating film.
含Al2O3绝缘膜的InAIN/GaN MOSHEMT
在本文中,我们研究了快速热退火(RTA)对Al2O3绝缘膜ain /GaN MOSHEMT电性能的影响。在样本上,我们测量了输入、输出和脉冲特性。因此,确定了阈值电压和外部跨导。在700℃退火后观察到RTA的影响更为显著。在这种情况下,与没有绝缘膜的HEMT结构相比,泄漏电流降低了约7个数量级。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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