Reducing the Thermal Budget in Low-Temperature Polyimide Dielectric Cure for Laser Direct Image Patterning in Advanced Backend Applications

Abstract

Using proprietary cure equipment with unique technology, YES and Deca Technologies partnered with material supplier FujiFilm to demonstrate a rapid cure process that delivers physical, mechanical, thermal, and electrical properties comparable to those resulting from conventional atmospheric cure. This paper describes the ultra-fast curing of FujiFilm's low-temperature polyimide LTC 9300 series. Not only was the cure time reduced to a mere 5 minutes, thereby reducing thermal budget, but also an imidization ratio of >98% as well as better elongation and glass transition temperature were achieved.