M. Rub, M. Bar, G. Deboy, F.-J. Niedemostheide, M. Schmitt, H. Schulze, A. Willmeroth
{"title":"550 V superjunction 3.9 /spl Omega/mm/sup 2/ transistor formed by 25 MeV masked boron implantation","authors":"M. Rub, M. Bar, G. Deboy, F.-J. Niedemostheide, M. Schmitt, H. Schulze, A. Willmeroth","doi":"10.1109/WCT.2004.239754","DOIUrl":null,"url":null,"abstract":"For the first time, we present experimental work on superjunction devices, in which the deep p-columns have been formed by a multi-step high-energy implantation. The desired blocking voltage and the Ron /spl times/ A are in the range of 500 V-600 V and about 3.5 - 4.0 /spl Omega/mm/sup 2/, respectively. Deep (32 /spl mu/m) p-n junctions were formed by using a set of five boron implantation energies ranging from 3 to 25 MeV. Masking was achieved by silicon stencil masks which were glued to the device wafers.","PeriodicalId":303825,"journal":{"name":"2004 Proceedings of the 16th International Symposium on Power Semiconductor Devices and ICs","volume":"48 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-05-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2004 Proceedings of the 16th International Symposium on Power Semiconductor Devices and ICs","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/WCT.2004.239754","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8
Abstract
For the first time, we present experimental work on superjunction devices, in which the deep p-columns have been formed by a multi-step high-energy implantation. The desired blocking voltage and the Ron /spl times/ A are in the range of 500 V-600 V and about 3.5 - 4.0 /spl Omega/mm/sup 2/, respectively. Deep (32 /spl mu/m) p-n junctions were formed by using a set of five boron implantation energies ranging from 3 to 25 MeV. Masking was achieved by silicon stencil masks which were glued to the device wafers.