A new multichip-on-silicon packaging scheme with integrated passive components

Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893) Pub Date : 1996-02-06 DOI:10.1109/MCMC.1996.510772

L. Guérin, R. Sachot, M. Dutoit

引用次数: 7

Abstract

A new multichip-on-silicon packaging scheme for microelectronic circuits, sensors and actuators is presented. Its main characteristics and advantages over other schemes are discussed. A description of some key fabrication steps is given. Finally, the realization and the characterization of passive integrated components such as inductors and capacitors are discussed.

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一种集成无源元件的多片单片封装新方案

提出了一种新的用于微电子电路、传感器和执行器的硅上多芯片封装方案。讨论了该方案的主要特点及优于其他方案的优点。给出了一些关键制作步骤的描述。最后，讨论了电感和电容等无源集成器件的实现和特性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)

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