How detrimental could a via be?

L. Shan, Y. Kwark, D. Dreps, J. Trewhella
{"title":"How detrimental could a via be?","authors":"L. Shan, Y. Kwark, D. Dreps, J. Trewhella","doi":"10.1109/EPEP.2004.1407555","DOIUrl":null,"url":null,"abstract":"The vertical interconnects used in printed circuit boards, known as vias, are becoming increasingly critical to interconnect performance with ever increasing system data rates. To explore the effects of vias on system link performance, both simulations and measurements on test structures were implemented in a wide frequency range. The results indicate that proper via management is vital to the success of interconnect designs operating at multi-Gb/s data rates.","PeriodicalId":143349,"journal":{"name":"Electrical Performance of Electronic Packaging - 2004","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging - 2004","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2004.1407555","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

Abstract

The vertical interconnects used in printed circuit boards, known as vias, are becoming increasingly critical to interconnect performance with ever increasing system data rates. To explore the effects of vias on system link performance, both simulations and measurements on test structures were implemented in a wide frequency range. The results indicate that proper via management is vital to the success of interconnect designs operating at multi-Gb/s data rates.
via的危害有多大?
印刷电路板中使用的垂直互连,称为过孔,随着系统数据速率的不断提高,对互连性能变得越来越重要。为了探讨通孔对系统链路性能的影响,在较宽的频率范围内对测试结构进行了仿真和测量。结果表明,适当的通孔管理对于多gb /s数据速率互连设计的成功至关重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信