Microstructure morphology of no-clean lead-free solder alloys used in automotive industry

Abstract

Under the current conditions of reducing manufacturing costs and complying with the RoHS 2 EU Recast Directive in the automotive industry, without compromising functionality and reliability, it has become necessary to create a new Lead-Free Solder Pastes family [1]. Mechanical and thermal solder joints functionalities are determined by the microstructure morphology. In this respect, the paper presents the phases morphology as function of cooling rate in Vapour Phase Soldering Process (VPSP), for three alloys coming from the solder pastes: ALPHA® OM-6106 (Sn62), ALPHA® OM-340 (InnoLot) and ALPHA® OM-535 (SBX02). The presented work extends the theoretical studies and experiments upon phase morphology in VPSP, in order to optimize soldering process of automotive electronic modules. The results could be extend for home and modern agriculture appliances industry [2].