Advanced ATM switching system hardware technology using MCM-D, stacking RAM microprocessor module

N. Yamanaka, T. Kawamura, K. Kaizu, A. Harada
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引用次数: 3

Abstract

This paper describes newly developed advanced ATM switching system hardware structures based on MCM-D microprocessor modules. The Si-substrate MCM-D technology which integrates microprocessor, interface control and peripheral control custom VLSIs, high-speed SRAMs, and FPGAs is employed. An MCM-D microprocessor module is realized by combining a Motorola 68030, high-performance ASICs, and high-speed SRAM caches. This is made possible by high density packaging and high-speed 4M-byte with parity cache using 25 ns access to 4-Mbit of SRAM memory. The MCM employs 12 SRAMs, possible with the stacked RAM technique, to reduce the module size by 7/8 compared to conventional surface mounting modules. This microprocessor module technology and MCM technology will advance the development of practical B-ISDN ATM switching systems.
先进的ATM交换系统硬件技术采用MCM-D、堆叠RAM微处理器模块
本文介绍了基于MCM-D微处理器模块的先进ATM交换系统的硬件结构。采用硅基板MCM-D技术,集成了微处理器、接口控制和外设控制定制vlsi、高速sram和fpga。MCM-D微处理器模块由摩托罗拉68030、高性能asic和高速SRAM缓存相结合实现。这是通过高密度封装和高速4m字节奇偶校验缓存实现的,使用25 ns访问4 mbit的SRAM存储器。MCM采用12个RAM,可能采用堆叠RAM技术,与传统的表面安装模块相比,模块尺寸减少了7/8。该微处理器模块技术和MCM技术将推动实际B-ISDN ATM交换系统的发展。
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