{"title":"A new generation EUV pellicle to enable future EUV lithographic nodes at enhanced productivity","authors":"G. Salmaso, R. Maas","doi":"10.1117/12.2600854","DOIUrl":null,"url":null,"abstract":"With EUV lithography now a stable part of the chip Industry production processes, the attention and demand for higher productivity is more pressing than ever. To support customers' demands, ASML has developed the next generation EUV pellicle, increasing the EUV transmittance and lifetime standards. Thanks to its unparalleled performance, the new generation pellicle boosts the scanner productivity more than 20% compared to the previous one.","PeriodicalId":169926,"journal":{"name":"International Conference on Extreme Ultraviolet Lithography 2021","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-09-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Conference on Extreme Ultraviolet Lithography 2021","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.2600854","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8
Abstract
With EUV lithography now a stable part of the chip Industry production processes, the attention and demand for higher productivity is more pressing than ever. To support customers' demands, ASML has developed the next generation EUV pellicle, increasing the EUV transmittance and lifetime standards. Thanks to its unparalleled performance, the new generation pellicle boosts the scanner productivity more than 20% compared to the previous one.