Chip-level verification for parasitic coupling effects in deep-submicron digital designs

Abstract

Interconnect parasitics are playing a dominant role in determining chip performance and functionality in deep-submicron designs. This problem is compounded by increasing chip frequencies and design complexity. As parasitic coupling capacitances are a significant portion of total capacitance in deep-submicron designs, verification of both performance and functionality assumes greater importance. This paper describes techniques for the modeling and analysis of parasitic coupling effects for large VLSI designs. Analysis results from a controlled experimental setup are presented to show the need for accurate cell models. Results from application of these techniques on a lending edge Digital Signal Processor (DSP) design are presented. Accuracy comparison with detailed SPICE-level analysis is included.