Mitigation techniques for single event induced charge sharing in a 90 nm bulk CMOS process

O. Amusan, L. Massengill, M. Baze, Bharat L. Bhuva, A. Witulski, J. D. Black, A. Balasubramanian, M. C. casey, Deborah Black, J. Ahlbin, Robert A. Reed, M. W. McCurdy
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引用次数: 51

Abstract

Mitigation techniques to reduce the increased SEU cross-section associated with charge sharing in a 90 nm DICE latch are proposed. The increased error cross-section is caused by heavy ion angular strikes depending on the directionality of the ion vector, thereby exacerbating charge sharing among multiple circuit nodes. The use of nodal separation as a mitigation technique shows an order of magnitude decrease on upset cross-section compared to a conventional layout and the use of guard-rings show no noticeable effect on upset cross-section.
90nm块体CMOS工艺中单事件诱导电荷共享的缓解技术
提出了缓解技术,以减少与90 nm DICE锁存器中电荷共享相关的增加的SEU横截面。增加的误差截面是由依赖于离子矢量方向性的重离子角冲击引起的,从而加剧了多个电路节点之间的电荷共享。与传统布局相比,使用节点分离作为缓解技术显示出加厚截面减少了一个数量级,而使用保护环对加厚截面没有明显影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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