Ghavam G. Shahidi, A. Ajmera, Fariborz Assaderaghi, R. Bolam, Andres Bryant, M. Coffey, H. Hovel, J. Lasky, E. Leobandung, H.-S. Lo, M. Maloney, D. Moy, Werner A. Rausch, D. Sadana, Dominic J. Schepis, M. Sherony, J. Sleight, Lawrence F. Wagner, K. Wu, Bijan Davari, T. Chen
{"title":"Mainstreaming of the SOI technology","authors":"Ghavam G. Shahidi, A. Ajmera, Fariborz Assaderaghi, R. Bolam, Andres Bryant, M. Coffey, H. Hovel, J. Lasky, E. Leobandung, H.-S. Lo, M. Maloney, D. Moy, Werner A. Rausch, D. Sadana, Dominic J. Schepis, M. Sherony, J. Sleight, Lawrence F. Wagner, K. Wu, Bijan Davari, T. Chen","doi":"10.1109/SOI.1999.819828","DOIUrl":null,"url":null,"abstract":"Partially-depleted deep sub-micron CMOS on SOI technology is becoming a mainstream technology. This technology offers 20-35% performance gain over a bulk technology implemented with the same lithography. In this paper, the challenges of mainstreaming the SOI technology in device, material, technology and circuit terms are described.","PeriodicalId":117832,"journal":{"name":"1999 IEEE International SOI Conference. Proceedings (Cat. No.99CH36345)","volume":"110 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1999 IEEE International SOI Conference. Proceedings (Cat. No.99CH36345)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOI.1999.819828","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 14
Abstract
Partially-depleted deep sub-micron CMOS on SOI technology is becoming a mainstream technology. This technology offers 20-35% performance gain over a bulk technology implemented with the same lithography. In this paper, the challenges of mainstreaming the SOI technology in device, material, technology and circuit terms are described.