High-resolution transmission electron microscopy on aged inp HBTs

B. Paine, T. Perham, S. Thomas
{"title":"High-resolution transmission electron microscopy on aged inp HBTs","authors":"B. Paine, T. Perham, S. Thomas","doi":"10.1109/GAASRW.2003.183769","DOIUrl":null,"url":null,"abstract":"Abstract We have used high-resolution transmission electron microscopy (HRTEM), with focused-ion-beam preparation of foils, to study InP HBT devices, both as-fabricated and after aging in life tests. The technology is HRL's G1 process. We found that even after aging for the equivalent of 2 × 107 h under normal operating conditions, the visible damage is extremely benign: the base and emitter contacts are completely intact, there is no evidence of significant Au or Pt migration into the semiconductor, and minor crystal disorder that develops does not extend more than 100 nm below the metal–semiconductor interfaces. Except for these regions, the intrinsic devices are completely devoid of any anomalous features, to within the 0.3 nm resolution limit of the measurements. These observations provide strong evidence that failure mechanisms involving migration of metal from the ohmic contacts, or extended crystal defects, do not limit the reliability of this technology. The small disorder under the base contacts can probably explain the increases of gain (β) observed early in our life tests, and small increases in the base-collector leakage occurring later in the life tests. The minor disorder under the emitter contacts can probably explain the moderate increase of emitter resistance observed late in our life tests. But the mechanism for the eventual decline in β, observed after a long period of stress, for the equivalent of 107 h of normal operation, is not apparent from the HRTEM images.","PeriodicalId":431077,"journal":{"name":"Proceedings GaAs Reliability Workshop, 2003.","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2004-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings GaAs Reliability Workshop, 2003.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GAASRW.2003.183769","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

Abstract We have used high-resolution transmission electron microscopy (HRTEM), with focused-ion-beam preparation of foils, to study InP HBT devices, both as-fabricated and after aging in life tests. The technology is HRL's G1 process. We found that even after aging for the equivalent of 2 × 107 h under normal operating conditions, the visible damage is extremely benign: the base and emitter contacts are completely intact, there is no evidence of significant Au or Pt migration into the semiconductor, and minor crystal disorder that develops does not extend more than 100 nm below the metal–semiconductor interfaces. Except for these regions, the intrinsic devices are completely devoid of any anomalous features, to within the 0.3 nm resolution limit of the measurements. These observations provide strong evidence that failure mechanisms involving migration of metal from the ohmic contacts, or extended crystal defects, do not limit the reliability of this technology. The small disorder under the base contacts can probably explain the increases of gain (β) observed early in our life tests, and small increases in the base-collector leakage occurring later in the life tests. The minor disorder under the emitter contacts can probably explain the moderate increase of emitter resistance observed late in our life tests. But the mechanism for the eventual decline in β, observed after a long period of stress, for the equivalent of 107 h of normal operation, is not apparent from the HRTEM images.
高解析度透射电镜观察老化的inp hts
摘要:我们利用高分辨率透射电子显微镜(HRTEM),聚焦离子束制备箔片,研究了InP HBT器件在制造和老化后的寿命测试。这项技术是HRL的G1工艺。我们发现,即使在正常工作条件下老化相当于2 × 107小时后,可见的损伤也是非常温和的:基极和发射极接触完全完好,没有明显的Au或Pt迁移到半导体中的证据,并且在金属-半导体界面以下扩展不超过100 nm的微小晶体无序发展。除了这些区域外,本征器件完全没有任何异常特征,在测量的0.3 nm分辨率限制内。这些观察结果提供了强有力的证据,表明涉及金属从欧姆接触迁移或扩展晶体缺陷的失效机制不会限制该技术的可靠性。基极触点下的小紊乱可能可以解释在我们的寿命试验中早期观察到的增益(β)的增加,以及在寿命试验后期发生的基极集电极泄漏的小增加。发射极触点下的轻微紊乱可能解释了我们在寿命试验后期观察到的发射极电阻的适度增加。但是,在长时间的应力作用(相当于107小时的正常工作)后观察到的β最终下降的机制,从HRTEM图像中并不明显。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信