The effect of leadframe finishing towards package delamination

Abstract

Package reliability depends on the integrity of the interface between various materials. Key interfaces are between epoxy-based mold compound to leadframe and chip surfaces. In the present work, the adhesion of epoxy-based mold compound and copper leadframe with various finishing is being discussed. It is observed that dendrite like feature on the leadframe finishing is critical to prevent delamination between the molding compound to leadframe.