{"title":"A case for lifetime-aware task mapping in embedded chip multiprocessors","authors":"Adam S. Hartman, D. E. Thomas, B. Meyer","doi":"10.1145/1878961.1878987","DOIUrl":null,"url":null,"abstract":"Temperature-aware design is emerging as a popular approach to addressing a variety of challenges, including system lifetime. In the case of task mapping, temperature-aware approaches indeed improve lifetime due to lifetime's strong dependence on tempera-ture. However, temperature-aware design neglects several important factors that also influence lifetime: (a) physical parameters such as supply voltage and current density, as well as (b) application and architecture characteristics that affect what failures are survivable. Only lifetime-aware task mapping can expose the relationship between physical parameters, component failure, and system lifetime, and therefore find lifetime-optimal mappings. To address this need, we have developed a new lifetime-aware task mapping technique based on ant colony optimization (ACO). Our technique produces task mappings resulting in lifetimes with-in 17.9% of the observed optimal results on average, outperform-ing a lifetime-agnostic task mapping approach by an average of 32.3%. We also observed that the lifetimes resulting from task mappings within 1% of the best maximum system temperature vary by an average of 20.1% while the lifetimes resulting from task mappings within 1% of the best average system temperature vary by an average of 32.6%. Our observations lead us to conclude that one cannot depend on temperature-aware task mapping when system lifetime is a design constraint, but one may depend on lifetime-aware task mapping when one or both of lifetime and temperature are design constraints.","PeriodicalId":118816,"journal":{"name":"2010 IEEE/ACM/IFIP International Conference on Hardware/Software Codesign and System Synthesis (CODES+ISSS)","volume":"52 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"40","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE/ACM/IFIP International Conference on Hardware/Software Codesign and System Synthesis (CODES+ISSS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/1878961.1878987","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 40
Abstract
Temperature-aware design is emerging as a popular approach to addressing a variety of challenges, including system lifetime. In the case of task mapping, temperature-aware approaches indeed improve lifetime due to lifetime's strong dependence on tempera-ture. However, temperature-aware design neglects several important factors that also influence lifetime: (a) physical parameters such as supply voltage and current density, as well as (b) application and architecture characteristics that affect what failures are survivable. Only lifetime-aware task mapping can expose the relationship between physical parameters, component failure, and system lifetime, and therefore find lifetime-optimal mappings. To address this need, we have developed a new lifetime-aware task mapping technique based on ant colony optimization (ACO). Our technique produces task mappings resulting in lifetimes with-in 17.9% of the observed optimal results on average, outperform-ing a lifetime-agnostic task mapping approach by an average of 32.3%. We also observed that the lifetimes resulting from task mappings within 1% of the best maximum system temperature vary by an average of 20.1% while the lifetimes resulting from task mappings within 1% of the best average system temperature vary by an average of 32.6%. Our observations lead us to conclude that one cannot depend on temperature-aware task mapping when system lifetime is a design constraint, but one may depend on lifetime-aware task mapping when one or both of lifetime and temperature are design constraints.