A case for lifetime-aware task mapping in embedded chip multiprocessors

Adam S. Hartman, D. E. Thomas, B. Meyer
{"title":"A case for lifetime-aware task mapping in embedded chip multiprocessors","authors":"Adam S. Hartman, D. E. Thomas, B. Meyer","doi":"10.1145/1878961.1878987","DOIUrl":null,"url":null,"abstract":"Temperature-aware design is emerging as a popular approach to addressing a variety of challenges, including system lifetime. In the case of task mapping, temperature-aware approaches indeed improve lifetime due to lifetime's strong dependence on tempera-ture. However, temperature-aware design neglects several important factors that also influence lifetime: (a) physical parameters such as supply voltage and current density, as well as (b) application and architecture characteristics that affect what failures are survivable. Only lifetime-aware task mapping can expose the relationship between physical parameters, component failure, and system lifetime, and therefore find lifetime-optimal mappings. To address this need, we have developed a new lifetime-aware task mapping technique based on ant colony optimization (ACO). Our technique produces task mappings resulting in lifetimes with-in 17.9% of the observed optimal results on average, outperform-ing a lifetime-agnostic task mapping approach by an average of 32.3%. We also observed that the lifetimes resulting from task mappings within 1% of the best maximum system temperature vary by an average of 20.1% while the lifetimes resulting from task mappings within 1% of the best average system temperature vary by an average of 32.6%. Our observations lead us to conclude that one cannot depend on temperature-aware task mapping when system lifetime is a design constraint, but one may depend on lifetime-aware task mapping when one or both of lifetime and temperature are design constraints.","PeriodicalId":118816,"journal":{"name":"2010 IEEE/ACM/IFIP International Conference on Hardware/Software Codesign and System Synthesis (CODES+ISSS)","volume":"52 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"40","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE/ACM/IFIP International Conference on Hardware/Software Codesign and System Synthesis (CODES+ISSS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/1878961.1878987","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 40

Abstract

Temperature-aware design is emerging as a popular approach to addressing a variety of challenges, including system lifetime. In the case of task mapping, temperature-aware approaches indeed improve lifetime due to lifetime's strong dependence on tempera-ture. However, temperature-aware design neglects several important factors that also influence lifetime: (a) physical parameters such as supply voltage and current density, as well as (b) application and architecture characteristics that affect what failures are survivable. Only lifetime-aware task mapping can expose the relationship between physical parameters, component failure, and system lifetime, and therefore find lifetime-optimal mappings. To address this need, we have developed a new lifetime-aware task mapping technique based on ant colony optimization (ACO). Our technique produces task mappings resulting in lifetimes with-in 17.9% of the observed optimal results on average, outperform-ing a lifetime-agnostic task mapping approach by an average of 32.3%. We also observed that the lifetimes resulting from task mappings within 1% of the best maximum system temperature vary by an average of 20.1% while the lifetimes resulting from task mappings within 1% of the best average system temperature vary by an average of 32.6%. Our observations lead us to conclude that one cannot depend on temperature-aware task mapping when system lifetime is a design constraint, but one may depend on lifetime-aware task mapping when one or both of lifetime and temperature are design constraints.
嵌入式芯片多处理器中生命周期感知任务映射的一个案例
温度感知设计正在成为解决包括系统寿命在内的各种挑战的流行方法。在任务映射的情况下,温度感知方法确实提高了生命周期,因为生命周期对温度有很强的依赖性。然而,温度感知设计忽略了几个同样影响寿命的重要因素:(a)物理参数,如电源电压和电流密度,以及(b)影响故障存活率的应用和架构特性。只有生命周期感知任务映射才能公开物理参数、组件故障和系统生命周期之间的关系,从而找到生命周期最优映射。为了解决这一需求,我们开发了一种新的基于蚁群优化(ACO)的生命周期感知任务映射技术。我们的技术生成的任务映射的生命周期平均在观察到的最优结果的17.9%之内,比生命周期无关的任务映射方法平均高出32.3%。我们还观察到,在最佳最高系统温度1%以内的任务映射产生的生命周期平均变化20.1%,而在最佳平均系统温度1%以内的任务映射产生的生命周期平均变化32.6%。我们的观察使我们得出结论,当系统生命周期是设计约束时,不能依赖于温度感知任务映射,但是当生命周期和温度中的一个或两个是设计约束时,可以依赖于生命周期感知任务映射。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信