Superjunction MOSFET with Trench Schottky Contact and Embedded High-k Insulator for Excellent Reverse Recovery

Rui Li, Mingmin Huang, Xi Zhang, Min Hu, Zhimei Yang, Yao Ma, M. Gong
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引用次数: 1

Abstract

A new superjunction MOSFET (SJ-MOSFET) with trench Schottky contact and embedded high-k insulator is proposed and investigated by TCAD simulations. In the reverse conduction state, the trench Schottky contact can easily collect electrons. So the hole injection efficiency of the body diode can be lowered to reduce the reverse recovery charge (Qrr). In addition, the high-k insulator is embedded in the p-pillar, which can increase the p-pillar resistance during reverse recovery so as to reduce the current recovery rate (dir/dt) from the peak reverse current (Irrm) to zero. Simulation results show that, the Qrr and dir/dt of the proposed SJ-MOSFET can be reduced by 46% and 71% respectively, compared with the conventional SJ-MOSFET.
具有沟肖特基触点和嵌入式高k绝缘体的超结MOSFET,具有优异的反向恢复
提出了一种具有沟槽肖特基触点和嵌入高k绝缘子的新型超结MOSFET (SJ-MOSFET),并通过TCAD仿真进行了研究。在反向导通状态下,沟槽肖特基触点容易收集电子。因此可以降低本体二极管的空穴注入效率,从而降低反向回收电荷(Qrr)。此外,高k绝缘子嵌入p柱,可以增加反向恢复时的p柱电阻,从而使电流恢复速率(dir/dt)从峰值反向电流(Irrm)降至零。仿真结果表明,与传统的SJ-MOSFET相比,所提出的SJ-MOSFET的Qrr和dir/dt分别降低了46%和71%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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