Suppression on Crosstalk Voltages of Paralleled SiC MOSFETs with Optimized Gate Configurations and Additional SiC SBDs

Cheng Zhao, Laili Wang, Juhui Yang, Shijie Wu, Yongmei Gan, Hongchang Cui
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Abstract

It is popular to parallel SiC MOSFETs for high-current applications. Compared with the single SiC MOSFET chip, the cross-turn-ON issues of paralleled SiC MOSFETs (PSMs) will be more complicated because of various mismatches in PSMs. This paper investigates the effects of all possible mismatches on the spurious gate-source voltages of PSMs (crosstalk voltages) by theoretical analysis and experiments. It is found that mismatched body diodes, asymmetric power-net layout and uneven junction temperature for PSMs can increase crosstalk voltages, leading to higher cross-turn-ON risk. Then the proportion of overall and separate gate resistance is adjusted and additional SiC Schottky Barrier diodes (SBDs) are employed to suppress crosstalk voltages of PSMs due to these mismatches. The effectiveness of both methods has be verified by experiments.
优化栅极结构和附加SiC sdd对并联SiC mosfet串扰电压的抑制
并联SiC mosfet用于大电流应用是很受欢迎的。与单片SiC MOSFET芯片相比,并联SiC MOSFET (psm)的交叉导通问题将更加复杂,因为psm中存在各种不匹配。本文通过理论分析和实验研究了各种可能的失配对psm串扰电压的影响。研究发现,不匹配的二极管体、不对称的电网布局和不均匀的结温会增加串扰电压,从而导致更高的交叉导通风险。然后调整总栅极电阻和单独栅极电阻的比例,并使用SiC肖特基势垒二极管(sbd)抑制psm由于这些不匹配而产生的串扰电压。实验验证了两种方法的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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