Knowledge Based Decision Support For Surface Mount Infrared Reflow Soldering

Abstract

Determination of the thermal profile for the InfraRed (IR) reflow soldering operation is a critical process in the surface mounted manufacture of Printed Circuit Boards (PCBs). An appropriate IR reflow profile is critical to ensuring good solder joints and high product yield levels. Determining an IR reflow profile requires the consideration of several factors. The heuristic knowledge required, the qualitative nature of the information used, and the vast quantity of information to be processed for IR reflow profile generation have made this an appropriate application for knowledge based expert systems. This paper describes the design, and development of a knowledge based system that assists in determining an IR reflow profile for single sided surface mount PCBs. The concepts used in this research relate to electronics packaging, surface mount PCB assembly, reflow soldering, and expert systems. The objectives of this research are identified, and the research methodology is described. The inputs and outputs to the system are delineated.