Dark Silicon — A thermal perspective

J. Henkel
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引用次数: 2

Abstract

Summary form only given. Dark Silicon is predicted to dominate the chip footage of upcoming many-core systems within a decade since Dennard Scaling fails mainly due to the voltage-scaling problem that results in higher power densities. It would deem upcoming technologies nodes inefficient since a majority of cores would lie fallow. International research efforts have recently started to investigate and mitigate Dark Silicon effects to ensure an effective use of available chip footage. The talk starts with an overview of state-of-the-art in Dark Silicon research and how it is driven by thermal constraints. Besides background on thermal issues and its impact on reliability, effective solutions are presented that scale especially with respect to many-core systems.
暗硅-热学视角
只提供摘要形式。由于Dennard Scaling的失败主要是由于电压缩放问题导致更高的功率密度,因此预计暗硅将在十年内主导即将到来的多核系统的芯片尺寸。它将认为即将到来的技术节点效率低下,因为大多数核心将闲置。国际上的研究工作最近开始调查和减轻暗硅效应,以确保有效利用可用的芯片素材。演讲首先概述了暗硅研究的最新进展,以及它是如何受到热约束的。除了热问题的背景及其对可靠性的影响外,还提出了有效的解决方案,特别是针对多核心系统。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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