High voltage tolerant ESD design for analog applications in deep submicron CMOS technologies

Abstract

A new high voltage tolerant (HVT) ESD design adopts one forward biased P+/N-well diode in series of one stacked NMOS to reduce the total capacitance and maintain the high ESD performance is proposed and implemented by 0.18 /spl mu/m CMOS technologies. The measured HBM and MM ESD levels of the HVT pin exceed 6 kV and 550 V, respectively, while the measured input capacitance is only 250 fF.