AlN filler for high thermal conductive resin materials

Abstract

Aluminum nitride (AlN) powder has has high thermal conductivity and is expected as filler for heat dissipation materials. Fine AlN powder after removing coarse particles by classification is well dispersed into resin, and it is possible to achieve high filling rate and high thermal conductivity. Further by improving the affinity to the resin by surface treatment, voids at interface between AlN particles and resin would decrease, and thus AlN in cured resin composite is hardly hydrolyzed. Classification and surface treatment can improve the filling property of AlN into resin and increase the reliability of the resin materials containing AlN.