A compact 30 GHz MMIC high power amplifier (3 W CW) in chip and packaged form

Abstract

This paper presents performance of a compact 3 W HPA (High Power Amplifier) in MMIC and packaged form at 30 GHz. A low cost high power packaged part was achieved by designing a compact MMIC and adopting a laminate substrate approach for a package. TriQuint standard 0.25 /spl mu/m PHEMT production process on 50 /spl mu/m substrate technology was used for a compact MMIC PA design. The output power at P1 dB (CW measurement) of MMIC and packaged parts are 34.9 dBm and 34.5 dBm with associated gain of 21.5 dB. These results are the highest CW-power and gain reported for a single MMIC and packaged part at Ka-band.