Photosensitive metamaterial for nanolithography

Abstract

This work presents the novel photosensitive metamaterial (metaphotoresist) with silver (Ag) and dielectric multilayer for ultraviolet nanolithography overcoming a diffraction limit. The metamaterial consists of multilayer with Ag and photoresist (PR) layers. A plasmonic UV light coupling under diffraction limit in the metamaterial was numerically demonstrated by using a finite difference time domain (FDTD) method. Nanolithography was demonstrated by using the metaphotoresist (meta-PR) and a conventional UV (λ=365 nm) alignment system. The meta-PR was fabricated by spin-coating of PR and angled deposition of Ag nanostructures. About 150 nm nanopatterns were fabricated. We believe that the metaphotoresist provides new direction for nanolithography industries.