An adaptive frequency control method using thermal feedback for reconfigurable hardware applications

Phillip H. Jones, Young-Hee Cho, J. Lockwood
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引用次数: 11

Abstract

Reconfigurable circuits running in field programmable gate arrays (FPGAs) can be dynamically optimized for power based on computational requirements and thermal conditions of the environment. In the past, FPGA circuits were typically small and operated at a low frequency. Few users were concerned about high-power consumption and the heat generated by FPGA devices. The current generation of FPGAs, however, use extensive pipelining techniques to achieve high data processing rates and dense layouts that can generate significant amounts of heat. FPGA circuits can be synthesized that can generate more heat than the package can dissipate. For FPGAs that operate in controlled environments, heatsinks and fans can be mounted to the device to extract heat from the device. When FPGA devices do not operate in a controlled environment, however, changes to ambient temperature due to factors such as the failure of a fan or a reconfiguration of bitfile running on the device can drastically change the operating conditions. A protection mechanism is needed to ensure the proper operation of the FPGA circuits when such a change occurs. To address these issues, we have devised a reconfigurable temperature monitoring system that gives feedback to the FPGA circuit using the measured junction temperature of the device. Using this feedback, we designed a novel dual frequency switching system that allows the FPGA circuits to maintain the highest level of performance for a given maximum junction temperature. Our working system has been implemented and deployed on the field programmable port extender (FPX) platform at Washington University in St. Louis. Our experimental results with a scalable image correlation circuit show up to a 2.4times factor increase in performance as compared to a system without thermal feedback. Our circuit ensures that the device performs the maximum required computation while always operating within a safe temperature range
一种用于可重构硬件应用的热反馈自适应频率控制方法
运行在现场可编程门阵列(fpga)中的可重构电路可以根据计算需求和环境热条件对功率进行动态优化。过去,FPGA电路通常很小,工作频率很低。很少有用户关心FPGA器件的高功耗和产生的热量。然而,当前一代的fpga使用广泛的流水线技术来实现高数据处理速率和密集的布局,可以产生大量的热量。可合成的FPGA电路产生的热量比封装散发的热量要多。对于在受控环境中工作的fpga,可以将散热器和风扇安装到设备上以从设备中提取热量。然而,当FPGA设备不在受控环境中工作时,由于风扇故障或设备上运行的位文件重新配置等因素导致的环境温度变化可能会极大地改变操作条件。当这种变化发生时,需要一种保护机制来确保FPGA电路的正常运行。为了解决这些问题,我们设计了一个可重构的温度监测系统,该系统使用测量到的器件结温向FPGA电路提供反馈。利用这种反馈,我们设计了一种新颖的双频开关系统,使FPGA电路在给定的最高结温下保持最高水平的性能。我们的工作系统已经在圣路易斯华盛顿大学的现场可编程端口扩展器(FPX)平台上实施和部署。我们的实验结果显示,与没有热反馈的系统相比,可扩展图像相关电路的性能提高了2.4倍。我们的电路确保设备执行所需的最大计算,同时始终在安全温度范围内运行
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