Noise coupling modeling and analysis of through glass via(TGV)

Abstract

In glass interposer based 2.5D/3D ICs, through glass via(TGV) noise coupling could critically affect overall system's performance. Therefore it is important to estimate exact noise coupling in glass interposers. Thus noise coupling modeling for glass interposer is needed. We proposed a TGV-TGV noise coupling model based on equivalent circuit model. Our TGV-TGV noise coupling structure for modeling verification is composed of TGVs and channel lines. So we proposed both TGV and channel line coupling model. In this paper, we verified our model using 3D-EM solver in frequency domain up to 20GHz by comparing the s-parameter. We analyzed noise coupling function with our model. Also, noise coupling reduction methods are proposed and their effects are analyzed on frequency domain and time domain.