{"title":"Noise measurements on Power4 Test chip","authors":"A. Haridass, N. James, B. McCredie","doi":"10.1109/EPEP.1999.819186","DOIUrl":null,"url":null,"abstract":"This paper describes on-chip noise measured on the Power4 Test chip and its impact on the performance of clock and logic circuitry on the chip. It also summarizes the effect of on-module decoupling capacitors on the on-chip noise. The Power4 Test chip was fabricated in 0.1 /spl mu/m effective channel length, 7 metal layer Cu, 1.5 V CMOS silicon-on-insulator technology. The test chip was designed to demonstrate technology feasibility and to facilitate chip and circuit design methodologies for the design of a 1 GHz microprocessor.","PeriodicalId":299335,"journal":{"name":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1999.819186","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper describes on-chip noise measured on the Power4 Test chip and its impact on the performance of clock and logic circuitry on the chip. It also summarizes the effect of on-module decoupling capacitors on the on-chip noise. The Power4 Test chip was fabricated in 0.1 /spl mu/m effective channel length, 7 metal layer Cu, 1.5 V CMOS silicon-on-insulator technology. The test chip was designed to demonstrate technology feasibility and to facilitate chip and circuit design methodologies for the design of a 1 GHz microprocessor.