J.G. Liu, B. M. Andersen, E. Bergmann, S. Fairchild
{"title":"Epoxy adhesives for optical element attachment in planar passive optical components","authors":"J.G. Liu, B. M. Andersen, E. Bergmann, S. Fairchild","doi":"10.1109/ECTC.2000.853286","DOIUrl":null,"url":null,"abstract":"Optical elements are bonded to the planar housing with adhesive materials for applications in a non-hermetic package of integrated passive optical devices. Eight epoxy adhesives have been evaluated in order to select the most suitable adhesive for use in a high-speed, automated assembly production facility. Tests were performed to examine the angular alignment accuracy and to determine the long-term adhesion and stability of the epoxy bonded components. Our results show that a thixotropic epoxy having high green strength, minimal shrinkage on cure, low outgassing and high resistance to humidity environment is suitable for bonding optical elements for the application.","PeriodicalId":410140,"journal":{"name":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2000.853286","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
Optical elements are bonded to the planar housing with adhesive materials for applications in a non-hermetic package of integrated passive optical devices. Eight epoxy adhesives have been evaluated in order to select the most suitable adhesive for use in a high-speed, automated assembly production facility. Tests were performed to examine the angular alignment accuracy and to determine the long-term adhesion and stability of the epoxy bonded components. Our results show that a thixotropic epoxy having high green strength, minimal shrinkage on cure, low outgassing and high resistance to humidity environment is suitable for bonding optical elements for the application.