Impact of Hydrided and Non-Hydrided Materials Near Transistors on Neutron-Induced Single Event Upsets

Shin-ichiro Abe, Tatsuhiko Sato, Junya Kuroda, S. Manabe, Y. Watanabe, Wang Liao, Kojiro Ito, M. Hashimoto, M. Harada, K. Oikawa, Y. Miyake
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引用次数: 4

Abstract

The impacts of hydrided and non-hydrided materials near transistors on neutron-induced single event upsets (SEUs) were investigated by simulating monoenergetic neutron irradiations on 65-nm technology bulk static random access memories. The onset energy of the SEUs induced by H ions depends on the shielding capability, i.e., the material and thickness, of components placed in front of transistors when those components do not contain hydrogen atoms. The shielding capability also influences the initial slope observed in the energy-dependence of SEU cross sections. Taking into account the non-hydrided component attached to memory cells used in the simulation, all experimental data measured at each neutron facility were reproduced well using SEU cross sections obtained by simulation. We also find that the effect of components near transistors on neutron-induced soft error rates is not negligible even for irradiation by white neutrons.
晶体管附近的氢化和非氢化材料对中子诱导单事件扰动的影响
通过模拟65纳米工艺体静态随机存储器的单能中子辐照,研究了晶体管附近的氢化和非氢化材料对中子诱导单事件扰动(seu)的影响。由氢离子诱导的seu的起始能量取决于屏蔽能力,即当这些组件不含氢原子时,放置在晶体管前面的组件的材料和厚度。屏蔽能力也会影响SEU截面能量依赖性的初始斜率。考虑到模拟中使用的存储单元附带的非氢化成分,在每个中子设施测量的所有实验数据都可以使用模拟获得的SEU截面很好地再现。我们还发现,即使在白中子照射下,晶体管附近的元件对中子诱导的软误差率的影响也是不可忽略的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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