High temperature superconductors-electrical considerations and possible applications in microelectronics

Abstract

The impact of VLSI integration trends on the requirements of chip-to-chip interconnects is reviewed. The propagation of on-chip and off-chip interconnection systems at liquid nitrogen temperatures are discussed for signal and power lines. Material properties of high T/sub c/-superconductors are considered and the resulting changes for transmission-line properties of superconducting interconnects are pointed out. Possible applications and some open problems are discussed.<>