{"title":"Energy efficient computing in nanoscale CMOS: Challenges and opportunities","authors":"V. De","doi":"10.1109/ASSCC.2014.7008875","DOIUrl":null,"url":null,"abstract":"Future computing systems spanning exascale supercomputers to wearable devices demand orders of magnitude improvements in energy efficiency while providing desired performance. The system-on-chip (SoC) designs need to span a wide range of performance and power across diverse platforms and workloads. The designs must achieve robust near-threshold-voltage (NTV) operation in nanoscale CMOS process while supporting a wide voltage-frequency operating range with minimal impact on die cost. Circuit and design technologies need to overcome the challenges posed by device parameter variations, supply noises, temperature excursions, aging-induced degradations, workload and activity changes, and reliability considerations.","PeriodicalId":161031,"journal":{"name":"2014 IEEE Asian Solid-State Circuits Conference (A-SSCC)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE Asian Solid-State Circuits Conference (A-SSCC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASSCC.2014.7008875","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 10
Abstract
Future computing systems spanning exascale supercomputers to wearable devices demand orders of magnitude improvements in energy efficiency while providing desired performance. The system-on-chip (SoC) designs need to span a wide range of performance and power across diverse platforms and workloads. The designs must achieve robust near-threshold-voltage (NTV) operation in nanoscale CMOS process while supporting a wide voltage-frequency operating range with minimal impact on die cost. Circuit and design technologies need to overcome the challenges posed by device parameter variations, supply noises, temperature excursions, aging-induced degradations, workload and activity changes, and reliability considerations.