Characterization of GaN HEMT under short-circuit events

Javier Galindos Vicente, D. Serrano, M. Vasić
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引用次数: 0

Abstract

In this paper, an analysis of the failure mecha-nisms and degradation indicators of GaN HEMTs is presented. Understanding how this technology fails is critical, especially for space applications. Due to radiation, a common failure mechanism in space applications for GaN devices is the short-circuit event. A systematic method is proposed to perform “on-board” measurement of the critical electrical parameters and analyze the behavior of DUTs under short-circuit failures to build a reliability model. A setup to characterize GaN HEMTs devices is developed, and multiple tests at different conditions have been performed. The reliability challenge of GaN devices could be addressed by having on-board, in-system prognostics and device health monitoring techniques to predict device failures well ahead of time.
短路事件下GaN HEMT的表征
本文对氮化镓hemt的失效机理和降解指标进行了分析。了解这项技术是如何失败的是至关重要的,特别是在太空应用中。由于辐射,GaN器件在空间应用中常见的失效机制是短路事件。提出了一种系统的方法,对关键电气参数进行“板上”测量,并分析被测设备在短路故障下的行为,以建立可靠性模型。开发了表征GaN hemt器件的装置,并在不同条件下进行了多次测试。GaN器件的可靠性挑战可以通过机载、系统内预测和设备健康监测技术来提前预测设备故障来解决。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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