{"title":"Characterization of GaN HEMT under short-circuit events","authors":"Javier Galindos Vicente, D. Serrano, M. Vasić","doi":"10.1109/APEC43599.2022.9773602","DOIUrl":null,"url":null,"abstract":"In this paper, an analysis of the failure mecha-nisms and degradation indicators of GaN HEMTs is presented. Understanding how this technology fails is critical, especially for space applications. Due to radiation, a common failure mechanism in space applications for GaN devices is the short-circuit event. A systematic method is proposed to perform “on-board” measurement of the critical electrical parameters and analyze the behavior of DUTs under short-circuit failures to build a reliability model. A setup to characterize GaN HEMTs devices is developed, and multiple tests at different conditions have been performed. The reliability challenge of GaN devices could be addressed by having on-board, in-system prognostics and device health monitoring techniques to predict device failures well ahead of time.","PeriodicalId":127006,"journal":{"name":"2022 IEEE Applied Power Electronics Conference and Exposition (APEC)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE Applied Power Electronics Conference and Exposition (APEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEC43599.2022.9773602","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
In this paper, an analysis of the failure mecha-nisms and degradation indicators of GaN HEMTs is presented. Understanding how this technology fails is critical, especially for space applications. Due to radiation, a common failure mechanism in space applications for GaN devices is the short-circuit event. A systematic method is proposed to perform “on-board” measurement of the critical electrical parameters and analyze the behavior of DUTs under short-circuit failures to build a reliability model. A setup to characterize GaN HEMTs devices is developed, and multiple tests at different conditions have been performed. The reliability challenge of GaN devices could be addressed by having on-board, in-system prognostics and device health monitoring techniques to predict device failures well ahead of time.