Diamond-a new high thermal conductivity substrate for multichip modules and hybrid circuits

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI:10.1109/ECTC.1993.346743

D. Norwood, W. Worobey, D. Peterson, D. Miller

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引用次数: 3

Abstract

Sandia National Laboratories is developing diamond substrate technology to meet the requirements of high thermal conductivity. Thin-film processes were developed and characterized to delineate conductor-resistor networks on free-standing diamond substrates having fine line gold conductors and low and high sheet resistivity resistors. Thin-film hybrid circuit technology was developed on CVD (chemical vapor deposition)-processed, polycrystalline diamond substrates having as-deposited surface finishes as well as those with polished surfaces. Conductors were defined by pattern plating gold and resistors were processed from sputtered tantalum nitride films which were deposited to sheet resistivities of 5 and/or 100 ohms per square. Resistor films on diamond substrates were evaluated for temperature coefficient of resistance (TCR), stability with time and temperature, and trimmability using YAG laser processing. Plated gold conductors were patterned on diamond to feature sizes of 25 microns and successfully tested for adhesion and bondability. Advanced YAG laser trimming techniques were developed to allow resistor trims on both low and high value resistors to within 1% of design value while maintaining required resistor stability.<>

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金刚石-用于多芯片模块和混合电路的新型高导热基板

桑迪亚国家实验室正在开发金刚石衬底技术，以满足高导热性的要求。薄膜工艺被开发和表征，以描绘具有细线金导体和低和高片电阻率电阻的独立金刚石衬底上的导体-电阻网络。薄膜混合电路技术是在CVD(化学气相沉积)加工的多晶金刚石衬底上开发的，这些衬底具有沉积的表面光面以及抛光的表面。导体由图案镀金定义，电阻器由溅射氮化钽薄膜加工而成，该薄膜的电阻率为每平方5和/或100欧姆。利用YAG激光加工技术，对金刚石衬底电阻薄膜的温度系数(TCR)、随时间和温度的稳定性以及可调谐性进行了评价。镀金导体在钻石上刻制成25微米的特征尺寸，并成功地测试了附着力和粘合性。开发了先进的YAG激光微调技术，允许在低值和高值电阻上的电阻微调到设计值的1%以内，同时保持所需的电阻稳定性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)

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