Acting capability of flux for Pb-free interconnection in electronics assembly

C. Du, Jing Zhao, Yunfei Du, Fang Chen, H. Zhao
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Abstract

The components and characteristics of flux used for Pb-free interconnection are discussed. Applying physical chemistry principles, the decisive factors, activation capability and limit of the flux's activity are analyzed. The results show that special flux must be used in Pb-free interconnections, and acting capability of flux mainly depends on the selected activator, and the built-up activator is an effective way to elevate activity. Flux with high activity can significantly enhance σs-f and reduce σl-f, but it can not reduce σs-l effectively. It is a basic reason why activity is difficult to exert. Reducing the fast growth of inter-metallic compound (IMC) at the interface is a vital measure to improve acting capability of flux.
电子装配中无铅互连焊剂的作用性能
讨论了无铅互连用助焊剂的组成和特性。应用物理化学原理,分析了助熔剂活性的决定因素、活化能力和极限。结果表明,无铅互连必须使用专用助焊剂,助焊剂的作用能力主要取决于所选用的活化剂,而组合活化剂是提高活性的有效途径。高活性助熔剂能显著提高σs-f,降低σl-f,但不能有效降低σs-l。这是运动难以发挥作用的一个基本原因。抑制金属间化合物(IMC)在界面处的快速生长是提高助焊剂作用能力的重要措施。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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