Test vehicle for MCM-D interconnect process development

Abstract

A test vehicle that allows for the evaluation of DC interconnect parametrics of lines and vias is discussed. Defect assessment test structures are also included to electrically evaluate open and short defects and their apparent size. Interconnect parametrics include effective electrical linewidth, sheet resistance, and via resistance as a function of via size. Defect assessment structures are designed as multiple serpentine via string and line structures that aid in the unambiguous detection of defects. Such structures can also classify the apparent size of the defect. The data available from this vehicle show the degree of process control achieved and the potential yield of the interconnect for a product application.<>