Mechanisms of dynamic pass leakage current in partially depleted SOI MOSFETs

T. Saraya, T. Hiramoto
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引用次数: 1

Abstract

The floating body effect is one of the most serious problems for applications of partially depleted (PD) SOI MOSFETs. In particular, the dynamic pass leakage caused by the floating body effect (Assaderaghi et al., 1996) degrades retention time in SOI DRAMs (Kim et al., 1996) and produces timing errors in dynamic circuits (Canada et al., 1999). Two mechanisms have been considered so far as the origin of dynamic pass leakage: (1) parasitic bipolar current (Assaderaghi et al., 1997; Wei and Antoniadis, 1996) and (2) subthreshold current (Kim et al., 1996; Morishita et al., 1995), as shown here, taking SOI DRAM cells as an example. However, no experimental data have been reported that distinguish between these two currents, and the mechanism of the dynamic pass leakage has not been reported. In this paper, the parasitic bipolar current and subthreshold current have been successfully separated in the transient measurements and the origin of the dynamic pass leakage has been clarified, to our knowledge, for the first time.
部分耗尽SOI mosfet中动态通漏电流的机理
浮体效应是影响部分耗尽SOI mosfet应用的最严重问题之一。特别是,由浮体效应引起的动态通漏(Assaderaghi et al., 1996)降低了SOI dram的保持时间(Kim et al., 1996),并在动态电路中产生时序误差(Canada et al., 1999)。到目前为止,有两种机制被认为是动态通漏的起源:(1)寄生双极电流(Assaderaghi et al., 1997;Wei and Antoniadis, 1996)和(2)阈下电流(Kim et al., 1996;Morishita et al., 1995),如图所示,以SOI DRAM单元为例。然而,目前还没有实验数据来区分这两种电流,动态通漏的机理也没有报道。本文在瞬态测量中成功地分离了寄生双极电流和亚阈值电流,并首次阐明了动态通漏的来源。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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