K. Shinohara, D. Regan, A. Corrion, D. Brown, I. Alvarado-Rodoriguez, M. Cunningham, C. Butler, A. Schmitz, S. Kim, B. Holden, D. Chang, V. Lee, P. Asbeck
{"title":"Deeply-Scaled E/D-Mode GaN-HEMTs for Sub-mm-Wave Amplifiers and Mixed-Signal Applications","authors":"K. Shinohara, D. Regan, A. Corrion, D. Brown, I. Alvarado-Rodoriguez, M. Cunningham, C. Butler, A. Schmitz, S. Kim, B. Holden, D. Chang, V. Lee, P. Asbeck","doi":"10.1109/CSICS.2012.6340075","DOIUrl":null,"url":null,"abstract":"In this paper, we report state-of-the-art high-frequency performance of GaN-based HEMTs achieved through innovative device scaling technologies such as vertically-scaled AlN/GaN/AlGaN double-heterojunction (DH) HEMT epitaxial structure, low-resistance n+-GaN ohmic contacts regrown by MBE, and manufacturable 20-nm self-aligned sidewall gate process. Engineering top barrier layer structure enabled both enhancement- and depletion-mode (E/D) device operations with record cutoff frequencies while maintaining Johnson figure of merit (JFoM) breakdown performance. Furthermore, E/D-mode devices were monolithically integrated using a full epitaxial regrowth technique with a successful demonstration of DCFL ring oscillator circuits. Deeply-scaled E/D-mode GaN-HEMTs with an unprecedented combination of high-frequency and high-breakdown characteristics offer practical advantages in circuit applications such as sub-millimeter-wave power amplifiers, ultra-linear mixers, and increased output power digital-to-analog converters.","PeriodicalId":290079,"journal":{"name":"2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSICS.2012.6340075","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
In this paper, we report state-of-the-art high-frequency performance of GaN-based HEMTs achieved through innovative device scaling technologies such as vertically-scaled AlN/GaN/AlGaN double-heterojunction (DH) HEMT epitaxial structure, low-resistance n+-GaN ohmic contacts regrown by MBE, and manufacturable 20-nm self-aligned sidewall gate process. Engineering top barrier layer structure enabled both enhancement- and depletion-mode (E/D) device operations with record cutoff frequencies while maintaining Johnson figure of merit (JFoM) breakdown performance. Furthermore, E/D-mode devices were monolithically integrated using a full epitaxial regrowth technique with a successful demonstration of DCFL ring oscillator circuits. Deeply-scaled E/D-mode GaN-HEMTs with an unprecedented combination of high-frequency and high-breakdown characteristics offer practical advantages in circuit applications such as sub-millimeter-wave power amplifiers, ultra-linear mixers, and increased output power digital-to-analog converters.