PCB Laminate Material Out-of-plane Dielectric Constant Extraction Methodology

Abstract

PCB laminate material with dense glass style has a layered structure of resin-fiberglass-resin. Out-of-plane dielectric constant (Dk) is required to achieve accurate transmission line modeling, but laminate manufacturers usually only provide in-plane Dk. This paper introduces a 3D electromagnetic analysis based methodology to extract out-of-plane Dk out from in-plane Dk specification. The correctness of the extracted out-of-plane Dk is confirmed by TDR correlation between measurement and simulation.