Kristof Dens, Joren Vaes, Simon Ooms, M. Wagner, P. Reynaert
{"title":"A PAM4 Dielectric Waveguide Link in 28 nm CMOS","authors":"Kristof Dens, Joren Vaes, Simon Ooms, M. Wagner, P. Reynaert","doi":"10.1109/ESSCIRC53450.2021.9567741","DOIUrl":null,"url":null,"abstract":"This work presents a dielectric waveguide communication link at 135 GHz, reaching 27 Gb/s non-return to-zero (NRZ) communication without any equalization at a bit-error-rate (BER) below 10−12 and up to 50 Gb/s 4-level pulse-amplitude modulation (PAM4) over 3 m of fiber at a BER below 10−6 when equalization is applied. This work is the first to break the 25 Gb/s barrier at distances of 1 m and above. These results are achieved by combining a low power, multilevel mm-wave transceiver with a coupler on printed circuit board (PCB) and a fiber design optimized for low dispersion.","PeriodicalId":129785,"journal":{"name":"ESSCIRC 2021 - IEEE 47th European Solid State Circuits Conference (ESSCIRC)","volume":"69 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ESSCIRC 2021 - IEEE 47th European Solid State Circuits Conference (ESSCIRC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSCIRC53450.2021.9567741","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 13
Abstract
This work presents a dielectric waveguide communication link at 135 GHz, reaching 27 Gb/s non-return to-zero (NRZ) communication without any equalization at a bit-error-rate (BER) below 10−12 and up to 50 Gb/s 4-level pulse-amplitude modulation (PAM4) over 3 m of fiber at a BER below 10−6 when equalization is applied. This work is the first to break the 25 Gb/s barrier at distances of 1 m and above. These results are achieved by combining a low power, multilevel mm-wave transceiver with a coupler on printed circuit board (PCB) and a fiber design optimized for low dispersion.