Wafer level reliability (WLR) special interest group (SIG)

Abstract

This year B vcry enthusiastic group of fificen people met to discuss WLKrncasurement methods, In a first step the WLR issues o f interest wcre collccted from the participants and the following list was compiled: Methods ofmonitoring. -How many companies use WLR? Evaluation/analysis of inensureincnt results. Correlation of long & short tcrm W l,R measurement results. Differences bctween parametric testing and WLR testing. ~ Important WI,R strcssmelhods: + EM, isothcimal test, CN; $. 'I'DDB, SII,C, thin oxides; +mobile ions; + non-volatile memorics; -II-IC; + low temperature testing; +plasma induccd damago. -Docs W1.R monitoring work? -What is the ob.jectivc/puipose of WLR monitoring; + qualification, -ttransfw, f development? Failurc criteria, scrap limits for WLK? I Who wants WLR monitoring? Can be ;a minimum time limit defined for WLR tests to get Activation of corrcct failure mechanisms. W1,R monitoring: a relative meaSurc or lifetime extrapolation? -Correlation between changes in the process & WLR monitoring rncmingful rcsults?