{"title":"Trends in laser packaging","authors":"D. Alles","doi":"10.1109/ECTC.1990.122187","DOIUrl":null,"url":null,"abstract":"The author reviews the advances in the electrical, mechanical, and optical design of laser packages over the past few years and indicates the current state of the art. The examples focus on how changes in the design and materials have resulted in performance improvements and cost reductions. A list of desirable future laser packages is presented.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"48 10","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"37","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"40th Conference Proceedings on Electronic Components and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1990.122187","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 37
Abstract
The author reviews the advances in the electrical, mechanical, and optical design of laser packages over the past few years and indicates the current state of the art. The examples focus on how changes in the design and materials have resulted in performance improvements and cost reductions. A list of desirable future laser packages is presented.<>