Reliability of Physical Unclonable Function under Temperature and Supply Voltage Variations

Manpreet Kaur, R. Rashidzadeh, R. Muscedere
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引用次数: 2

Abstract

Physically Unclonable Function (PUF) has emerged as a cost-effective building block for crypto cores and security system. The unique signature of a PUF is primarily attributed to the process variations where the effects of other factors such as supply voltage, temperature and aging are considered to be minor. In this work, detail analysis to evaluate supply voltage and temperature effects on PUF reliability is presented. It is shown that the effects of supply voltage and temperature variations on PUF reliability can be comparable to the effects of process variations. It is also shown how temperature variation affects propagation delay of logic cells and consequently undermines PUF reliability. Simulation results using CMOS $0.18\mu \mathrm{m}$ technology in Cadence environment with $\pm 10\%$ power supply variations for a temperature range of-400C to $+70^{0}\mathrm{C}$ indicate that these effects can reduce PUF reliability by more than 58%.
温度和电源电压变化下物理不可克隆函数的可靠性
物理不可克隆功能(PUF)已成为一种具有成本效益的加密核心和安全系统的构建模块。PUF的独特特征主要归因于工艺变化,其中其他因素(如电源电压,温度和老化)的影响被认为是次要的。本文详细分析了电源电压和温度对PUF可靠性的影响。结果表明,电源电压和温度变化对PUF可靠性的影响可与工艺变化的影响相媲美。还显示了温度变化如何影响逻辑单元的传播延迟,从而破坏PUF的可靠性。在Cadence环境中使用CMOS $0.18\mu \ mathm {m}$技术,在- 400c至$+70 \ mathm {C}$的温度范围内,采用$\pm 10\%$电源变化进行仿真结果表明,这些影响会使PUF可靠性降低58%以上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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