Improving performance in single field plate power High Electron Mobility Transistors (HEMTs) based on AlGaN/GaN

M. Fathipour, N. Peyvast, Reza Azadvari
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Abstract

In this paper we have investigated the effectiveness of employing the Single Field-Plate (SFP) technique to enhance the breakdown voltage (BV) of AlGaN/GaN power High Electron Mobility Transistors (HEMTs).A systematic procedure is provided for designing the SFP device, using two dimensional (2-D) simulation to obtain the maximum improvement in the drain-source current (IDS) and to achieve maximum breakdown voltage. It is found that significantly higher breakdown voltages and IDS can be achieved by just raising the thickness of the passivation layer Si3N4 beneath SFP (t) and raising SFP length (Lsfp) between the source and drain. We demonstrate that when a single field-plate connected to the source is employed, both breakdown voltage and IDS can be enhanced by optimizing the passivation layer Si3N4 thickness beneath the SFP as well as the SFP geometry.
基于AlGaN/GaN的单场板功率高电子迁移率晶体管(hemt)的性能改进
本文研究了采用单场极板(SFP)技术提高AlGaN/GaN功率高电子迁移率晶体管(hemt)击穿电压(BV)的有效性。提供了一个系统的程序来设计SFP器件,使用二维(2-D)仿真来获得漏源电流(IDS)的最大改进和最大击穿电压。研究发现,只要提高SFP (t)下钝化层Si3N4的厚度和提高源极和漏极之间的SFP长度(Lsfp),就可以获得显著更高的击穿电压和IDS。我们证明,当使用单个场极板连接到源时,可以通过优化SFP下的钝化层Si3N4厚度以及SFP的几何形状来提高击穿电压和IDS。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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