Thermal Modeling of VCSEL-based Optoelectronic Modules

Abstract

In recent years, many papers have been published about the thermal properties of a single vertical cavity surface emitting laser (VCSEL) and two-dimensional (2-D) arrays. However, a thermal model of VCSEL-based optoelectronic modules has needed to be developed, since the temperature distribution and heat dissipation in optoelectronic packaging affect the device's output characteristics. The device heating places upper limits on the maximum obtainable power as well as on the temperature range of operation. The development of reliable VCSEL-based optoelectronic modules strongly depends on proper thermal management.