3D investigation of photonics elements by means of interferometric and photoelastic tomography

N. Kumar, M. Kujawińska, P. Kniażewski
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Abstract

In the paper we present interferometric and photoelastic tomography methods applied for the 3D studies of refractive index (n) and birefringence (B) in photonics components such as optical fibres and microelements produced or replicated by a variety of novel technologies including deep proton writing (DPW) and hot embossing technology. The enhanced automated measurement and data analysis procedures are described and the experimental results obtained for microobjects working in transmission are given. Also the methodology to combine the tomographic data for full characterization of internal structure of 3D photonics elements is provided. The main samples under test are: microlens fabricated by DPW, Panda fibre and massive waveguide microinterferometer in the form of cuboids produced by hot embossing process.
干涉法和光弹性层析成像技术对光子元件的三维研究
在本文中,我们介绍了干涉测量和光弹性层析成像方法,用于光学元件(如光纤和微元素)的折射率(n)和双折射(B)的三维研究,这些光子元件由各种新技术生产或复制,包括深质子写入(DPW)和热压印技术。介绍了增强的自动化测量和数据分析程序,并给出了在传输中工作的微物体的实验结果。同时给出了结合层析数据全面表征三维光子元件内部结构的方法。测试的主要样品有:DPW制成的微透镜、Panda纤维和热压成型长方体的大质量波导微干涉仪。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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